Light bar, edge-type backlight module and display device

ABSTRACT

A light bar, an edge-type backlight module and a display device. The light bar includes a circuit board and an integrated light emitting body arranged on the circuit board, wherein the integrated light emitting body includes a package and a plurality of light sources, and the package is configured to package the plurality of light sources.

CROSS REFERENCE OF THE RELATED APPLICATION

The present application claims priority to the Chinese PatentApplication No. 201621169497.0 filed on Nov. 2, 2016, the entiredisclosure of which is incorporated herein by reference as part of thepresent application.

TECHNICAL FIELD

The present disclosure relates to a light bar, an edge-type backlightmodule and a display device.

BACKGROUND

With the rapid development of the display technology, a technology ofnarrow bezel and wide viewing angle has become the mainstreamdevelopment trend of the display panel. The technology of narrow bezeland wide viewing angle can bring a better visual experience to an user.In a structure of a current electronic device, an LED (Light EmittingDiode) that is used as a light source is a point light source, and alight mixing distance between the LEDs is relatively long, at least morethan 2.5 mm, which cause a light incident distance of a backlight modulebeing more than 2.8 mm, thus hampering the maximization of a viewableregion of the electronic device, and limiting the development of narrowbezel technology.

SUMMARY

At least one embodiment of the present disclosure provides a light bar,the light bar comprises a circuit board and an integrated light emittingbody that is arranged on the circuit board; wherein the integrated lightemitting body comprises a package and a plurality of light sources, andthe package is configured to package the plurality of light sources.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, a material of the package is a light permeablematerial.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, the plurality of light sources are connected inparallel or in series.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, the light source is an LED, and a plurality of LEDsare packaged in a direct package way.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, a light emitting surface of the integrated lightemitting body is perpendicular to the circuit board, a distance betweenthe light emitting surface and an edge of the circuit board that isclose to the light emitting surface is W1, and 0.3 mm≤W1≤1.0 mm.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, in a length direction of the circuit board, adistance between an edge of the integrated light emitting board and aclose edge of the circuit board is L1, and L1>0.5 mm.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, the integrated light emitting body is fixedlyconnected with the circuit board through a pad, and a radius of the padR≤0.3 mm.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, a thickness of the circuit board is D1, and 0.06mm≤D1≤0.12 mm.

For example, in the light bar provided by at least one embodiment of thepresent disclosure, a thickness of the integrated light emitting body isD2, and 0.3 mm≤D2≤0.6 mm.

At least one embodiment of the present disclosure provides an edge-typebacklight module, the edge-type backlight module comprises any one ofthe above light bars.

For example, the edge-type backlight module provided by at least oneembodiment of the present disclosure further comprises a light guideplate, wherein the light guide plate is arranged on a side of a lightemitting surface of the light bar, and the circuit board is arranged onthe light guide plate.

For example, in the edge-type backlight module provided by at least oneembodiment of the present disclosure, the light bar is fixed to thelight guide plate by a glue that is arranged on a main surface of thecircuit board, the glue covers the light bar and exposes the integratedlight emitting body.

For example, in the edge-type backlight module provided by at least oneembodiment of the present disclosure, in a width direction of the lightbar, the glue exceeds a side edge of the light bar.

For example, in the edge-type backlight module provided by at least oneembodiment of the present disclosure, the width of the glue exceedingthe edge of the light bar is W2, and 0.25 mm≤W2≤1.0 mm.

For example, at least one embodiment of the present disclosure providesan edge-type backlight module, the edge-type backlight module furthercomprises an optical film that is arranged on a light exit side of thelight guide plate, and the optical film overlaps the side edge thatexceeds the light bar of the glue.

For example, in the edge-type backlight module provided by at least oneembodiment of the present disclosure, a thickness of the glue is D3, and0.03 mm≤D3≤0.06 mm.

For example, in the edge-type backlight module provided by at least oneembodiment of the present disclosure, a gap between the glue and theintegrated light emitting body is W3, and 0.1 mm≤W3≤0.15 mm.

For example, at least one embodiment of the present disclosure providesan edge-type backlight module, the edge-type backlight module furthercomprises a light shielding tape, wherein the light shielding tape isarranged on a back surface of the circuit board of the light bar andextends from an edge of the circuit board onto the light guide plate.

For example, in the edge-type backlight module provided by at least oneembodiment of the present disclosure, a distance between a light exitsurface of the light bar and an edge of the light shielding tape on thelight guide plate is K, and 0.8 mm≤K≤2.0 mm.

At least one embodiment of the present disclosure provides a displaydevice, the display device comprises any one of the above edge-typebacklight modules.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of the embodimentsof the disclosure, the drawings of the embodiments will be brieflydescribed in the following; it is obvious that the described drawingsare only related to some embodiments of the disclosure and thus are notlimitative of the disclosure.

FIG. 1 is a structure schematic diagram of a light bar in an embodimentof the present disclosure;

FIG. 2 is a cross-section view of the light bar in FIG. 1 along a AA′direction;

FIG. 3 is a structure schematic diagram of a light bar in an embodimentof the present disclosure;

FIG. 4 is a structure schematic diagram of a edge-type backlight modulein an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a glue being arranged on a light bar inan embodiment of the present disclosure; and

FIG. 6 is schematic diagram of a glue being arranged on a light bar inanother embodiment of the present disclosure.

DETAILED DESCRIPTION

In order to make objects, technical details and advantages of theembodiments of the disclosure apparent, the technical solutions of theembodiments will be described in a clearly and fully understandable wayin connection with the drawings related to the embodiments of thedisclosure. Apparently, the described embodiments are just a part butnot all of the embodiments of the disclosure. Based on the describedembodiments herein, those skilled in the art can obtain otherembodiment(s), without any inventive work, which should be within thescope of the disclosure.

Unless otherwise defined, all the technical and scientific terms usedherein have the same meanings as commonly understood by one of ordinaryskill in the art to which the present disclosure belongs. The terms“first,” “second,” etc., which are used in the description and theclaims of the present application for disclosure, are not intended toindicate any sequence, amount or importance, but distinguish variouscomponents. Also, the terms such as “a.” “an,” etc., are not intended tolimit the amount, but indicate the existence of at least one. The terms“comprise,” “comprising,” “include,” “including,” etc., are intended tospecify that the elements or the objects stated before these termsencompass the elements or the objects and equivalents thereof listedafter these terms, but do not preclude the other elements or objects.The phrases “connect”, “connected”, etc., are not intended to define aphysical connection or mechanical connection, but may include anelectrical connection, directly or indirectly. “On,” “under,” “right,”“left” and the like are only used to indicate relative positionrelationship, and when the position of the object which is described ischanged, the relative position relationship may be changed accordingly.

It should be noted that shapes and sizes of components in the drawingsdo not reflect the true scale, and merely intend to illustrate thecontent of the present disclosure.

An embodiment of the present disclosure provides a light bar, forexample, FIG. 1 is a structure schematic diagram of the light bar in anembodiment of the present disclosure; FIG. 2 is a cross-section view ofthe light bar in FIG. 1 along a AA′ direction. As illustrated in FIG. 1and FIG. 2, the light bar comprises a circuit board 10 and an integratedlight emitting body 20 that is arranged on the circuit board 10; theintegrated light emitting body 20 comprises a package 22 and a pluralityof light sources 21, and the package 22 is configured to package theplurality of light sources 21, for example, the light sources 21 arepackaged integrally.

For example, a material of the package 22 is a light transmittablematerial, for example, transparent glass, transparent resin andtransparent plastic and so on.

For example, the circuit board 10 is configured to provide a signal tothe light source 21 to make the light source 21 emit light. Consideringthat a flexible printed circuit (FPC) has characteristics of smallvolume, light weight, being bended freely and so on, the circuit board10 is, for example, an FPC.

A dashed-line frame portion in FIG. 1 is a wire 11 that is extended fromthe circuit board 10. For example, the wire 11 is electrically connectedto the light source 21 and connected to an external device.

In at least some embodiments, the plurality of light sources 21 may beconnected in parallel or in series, which is not limited herein. Forexample, the light source is an LED, and a plurality of LEDs arepackaged in a direct package way.

The light source 21 is, for example, a light emitting bare chip, and onthis basis, the integrated light emitting body 20 may be obtained byintegrally packaging a plurality of light emitting bare chips.

In at least some embodiments, a length of the integrated light emittingbody 20 is less than a length of the circuit board 10, and a width ofthe integrated light emitting body 20 is less than a width of thecircuit board 10. On this basis, the length and width of the integratedlight emitting body 20, as well as the length and width of the circuitboard 10 may be selected according to an apparatus to which the lightbar is actually applied.

For example, when the light bar is used in a backlight module of amobile phone, because the backlight module of the mobile phone generallyadopts an edge-type backlight module, the length of the circuit board 10is related to a length of the mobile phone. The width of the circuitboard 10 may range from 2.0 mm to 2.8 mm, for example, about 2.2 mm, 2.3mm, 2.4 mm, 2.8 mm and so on; correspondingly, the width of theintegrated light emitting body 20 may range from 0.5 mm to 0.8 mm, forexample, about 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, and so on.

As illustrated in FIG. 2, a thickness D1 of the circuit board 10 may becontrolled to range from 0.06 mm to 0.12 mm, for example, be about 0.06mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.12 mm and so on.

For example, a thickness of the integrated light emitting body 20 isrelated to a thickness of the light source 21. The thickness D2 of theintegrated light emitting body 20 may be controlled to range from 0.3 mmto 0.6 mm, for example, be about 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm and soon. Based on this, when selecting the light source 21, the light source21 with a small thickness may be selected.

At present, the light bar comprises a plurality of point light sources,and a light mixing distance between the point light sources is 2.5 mm atleast, which is unfavorable for the narrow bezel design. In the lightbar provided in the embodiment of the present disclosure, the pluralityof light sources 21 are packaged by the package 22 to obtain theintegrated light emitting body 20, so that light beams emitted by theintegrated light emitting body 20 are more denser, and the light mixingdistance of the integrated light emitting body 20 is reduced, therefore,the light incident distance of the backlight module can be reduced,which is favorable for obtaining a backlight module structure withsuper-short light incident distance, thus a viewable region of thedisplay device can be increased and the narrow bezel design of thedisplay device can be realized.

For example, FIG. 3 is a structure schematic diagram of a light bar inan embodiment of the present disclosure. Considering that a LED (LightEmitting Diode) has advantages of high brightness, low heat, low energyconsumption and long service life, and a thickness of the LED may beless than 0.3 mm, therefore, as illustrated in FIG. 3, the light source21 may be LED 201 and a plurality of LEDs 201 are packaged by a way ofCOB (Chip On Board).

For example, the LED 201 may be an LED bare chip.

For example, a plurality of LEDs 201 are packaged by a way of COB, thispackage way comprises: a plurality of LEDs 201 are welded on a substrateby a welding technique, and then the substrate with a plurality of LEDs201 welded is integratedly packaged by a COB integrated packagingtechnique, and the integrated light emitting body 20 that is illustratedin FIG. 3 may be obtained. On this basis, the substrate is welded on thecircuit board 10.

For example, the substrate is a metal substrate, and a material of themetal substrate is, for example, aluminum alloy or copper alloy. Due tothe conductivity of the metal, on the one hand, the circuit board 10 maydrive the integrated light emitting body 20 to emit light, on the otherhand, the metal substrate can be favorable for the heat dissipation ofthe light bar, therefore improving the service life of the light bar.

In the embodiment of the present disclosure, the plurality of LEDs 201are packaged by a way of COB, so that the light mixing distance of theintegrated light emitting body 20 can range from 0.5 mm to 1.5 mm, forexample, be about 0.5 mm, 0.7 mm, 0.9 mm, 1.2 mm, 1.5 mm and so on,which is favorable for obtaining a backlight module structure withsuper-short light incident distance, and adopting the COB package waycan ensure the light emitting property of the light bar.

For example, as illustrated in FIG. 3, a light emitting surface (forexample, a surface from which light exits in FIG. 3) of the integratedlight emitting body 20 is perpendicular to the circuit board 10; adistance between the light emitting surface to an upper edge 10 a of thecircuit board 10 that is close to the light emitting surface is W1, and0.3 mm≤W1≤1.0 mm, for example, W1 is about 0.3 mm, 0.5 mm, 0.7 mm, 0.9mm, 1.0 mm and so on.

For example, when the light bar is used in an edge-type backlight modulestructure, for example, the light bar may be fixed on a light guideplate, in this case, if the distance W1 between the light emittingsurface and the upper edge 10 a of the circuit board 10 that is close tothe light emitting surface is too short, it is easy to lead to theuptight fixing of the light guide plate and the light bar, resulting indetachment of the light guide plate; if W1 is too long, a large lightingloss of LED 201 may be caused, therefore the range of W1 is selected as0.3 mm≤W1≤1.0 mm.

For example, the range of W1 may also be selected as 0.3 mm≤W1≤0.6 mm.

For example, as illustrated in FIG. 3, along a length direction of thecircuit board 10, a distance between a left edge of the integrated lightemitting body 20 and a left edge 10 b of a closed circuit board 10 isL1, for example, L1>0.5 mm. Obviously, the length of L1 cannot be toolong, for example, the length of L1 is less than 1/10 of the length ofthe circuit board.

For example, as illustrated in FIG. 3, a distance between a right edgeof the integrated light emitting body 20 and a right edge 10 c of thecircuit board 10 is L2, the distance between the left edge of theintegrated light emitter 20 and the left edge of the circuit board 10 isL1, and L1 may be equal to or not equal to L2. In the embodiment of thepresent disclosure, the illustration is made by taking L1 being equal toL2 as an example.

When the light bar is used in an edge-type backlight module structure,for example, two ends of the circuit board 10 may be fixed to the lightguide plate of the backlight module along the length direction of thecircuit board 10, at this time, enough area is left at the two ends ofcircuit board 10 along its length direction. Due to the width of thecircuit board 10 is small, L1 is set to be sufficiently large along thelength direction of the circuit board 10. Through testing, it is foundthat L1>0.5 mm may satisfy the fixing of the light bar and the lightguide plate structure of the backlight module. For example, the lengthof L1 is about 0.5 min, 0.6 min, 0.8 mm and so on.

As illustrated in FIG. 3, the integrated light emitting body 20 isfixedly connected to the circuit board 10 through a pad 23. In thiscase, if a radius of the pad 23 is too large, the light incidentdistance is increased correspondingly. Therefore, the radius of the pad23 may be selected as R≤0.3 mm. For example, the radius R of the pad 23is about 0.2 mm, 0.25 mm, 0.3 mm and so on.

It should be noted that the number of the pads is not limited, as longas the integrated light emitting body 20 can be fixed on the circuitboard 10.

At least one embodiment of the present disclosure further provides anedge-type backlight module, the edge-type backlight module comprises anyone of the above light bars.

For example, FIG. 4 is a structure schematic diagram of an edge-typebacklight module in an embodiment of the present disclosure. Asillustrated in FIG. 4, the edge-type backlight module further comprisesa light guide plate 40, the light guide plate 40 is arranged on a side(for example, a light exit surface) of a main surface 101 of the lightbar. The light bar is fixed to the light guide plate 40 through a glue80. For example, the glue 80 covers the light bar and exposes theintegrated light emitting body 20.

For example, FIG. 5 is a schematic diagram of the glue being arranged ona light bar in an embodiment of the present disclosure. For example, asillustrated in FIG. 5, in a side of the main surface 101 of the lightbar, namely a side of the light exit surface, an edge of the glue 80that covers the light bar may exceed the light bar.

For example, FIG. 6 is a schematic diagram of the glue being arranged ona light bar in another embodiment of the present disclosure. Asillustrated in FIG. 6, the edge of the glue 80 that covers the light barmay also not exceed the light bar, as long as the light bar is fixed tothe light guide plate 40.

For example, the glue 80 is also used to fix the light bar and a glueframe 60, except for being used to fix the light bar and the light guideplate 40, as illustrated in FIG. 4.

In the embodiment of the present disclosure, the glue 80 covers a partof the main surface 101 of the light bar and exposes the integratedlight emitting body 20, on the one hand, which can make the light bar tobe fixed with the structures, such as the light guide plate 40 and soon, of the backlight module, and on the other hand, which can avoid theadverse effect on the light emitting due to the glue 80 covering theintegrated light emitting body 20.

For example, as illustrated in FIG. 5, a gap W3 between the glue 80 andthe integrated light emitting body 20 ranges from 0.1 mm to 0.15 mm, forexample, W3 is about 0.1 mm, 0.12 mm, 0.13 mm, 0.15 mm or other values,this arrangement can avoid the glue 80 thermally expanding due to theheat that is generated by the integrated light emitting body 20 when theglue 80 and the integrated light emitting body 20 are too close.

For example, as illustrated in FIG. 4, if a thickness D3 of the glue 80is too large, the light emitted by the integrated light emitting body 20is shielded; if the thickness D3 of the glue 80 is too small, the fixingeffect is not good. Therefore, the thickness D3 of the glue 80 may beselected to range from 0.03 mm to 0.06 mm. For example, the thickness D3of the glue 80 may be about 0.03 mm, 0.04 mm, 0.05 mm or other values.

For example, as illustrated in FIG. 4, the edge-type backlight modulefurther comprises an optical film 50 that is arranged on a lightemitting side of the light guide plate 40, as illustrated in FIG. 5, ina width direction of the light bar, namely a direction of BB′, the glue80 exceeds a side edge of the light bar, the optical film 50 overlaps aportion that exceeds the light bar of the glue 80. A width of the glue80 exceeding the edge of the light bar is W2, and 0.25 mm≤W2≤1.0 mm,such as about 0.25 mm, 0.3 mm, 0.5 mm, 1.0 mm and so on. For example, arange of W2 may also be 0.25 mm≤W2≤0.4 mm.

For example, the optical film 50 may comprise a diffusion sheet 51, alower prism 52 and an upper prism 53 that are sequentially arranged onthe light guide plate 40. The diffusion sheet 51 may overlap the portionthat exceeds the light bar of the glue 80.

For example, in order to prevent the edge-type backlight module fromwarping caused by the extrusion between the light bar and the opticalfilm 50 resulted from the thermal expansion of the light bar, there is acertain gap between the optical film 50 and the light bar, and a widthof the gap may be about 0.2 mm.

For example, in the embodiment of the present disclosure, a width of theglue 80 exceeding an edge of the light bar is W2, and 0.25 mm≤W2≤1.0 mm,on the one hand, it can ensure that a gap between the optical film 50and the light bar is reserved on the basis of overlapping between theoptical film 50 and the glue 80, and on the other hand, the problem thatthe light loss is too large due to W2 being too large can be avoided.

For example, as illustrated in FIG. 4, the edge-type backlight modulefurther comprises a light shielding tape 70 which is arranged above thecircuit board 10 of the light bar and extending from an edge of thecircuit board 10 onto the light guide plate 40. A distance between thelight emitting surface of the light bar and an edge of the lightshielding tape 70 above the light guide plate 40 is K, for example, 0.8mm≤K≤2.0 mm. For example, the distance between the light emittingsurface of the light bar and the edge of the light shielding tape 70above the light guide plate 40 may be about 0.8 mm, 0.9 mm, 1.0 mm, 1.1mm, 1.2 mm and so on. For example, the distance between the lightemitting surface of the light bar and the edge of the light shieldingtape 70 above the light guide plate 40 may also be in the range of 0.8mm≤K≤1.0 mm.

For example, on the one hand, the light shielding tape 70 can shield thelight from a part of the light emitting surface of the backlight modulewith nonuniform brightness, so as to make the light be emitted outuniformly on the display region of the display device; on the otherhand, the light shielding tape 70 can also fix the optical film 50.

For example, in the embodiment of the present disclosure, the lightincident distance of the edge-type backlight module may reach about 0.8mm under the limit condition. As compared with a current edge-typebacklight module, the light incident distance may be reduced by 2 mm atmaximum, and a corresponding viewable region can be increased by 2 mm.

For example, as illustrated in FIG. 4, the edge-type backlight modulefurther comprises a reflection sheet 30, the reflection sheet 30 isarranged on a side opposite to the light emitting side of the lightguide plate 40, wherein the reflection sheet 30 is fixed with the lightbar and the glue frame 60 through a reflection sheet glue 81.

The embodiment of the present disclosure can improve the lightutilization efficiency by arranging the reflection sheet 30.

At least one embodiment of the present disclosure further provides adisplay device, the display device comprise any one of the aboveedge-type backlight modules.

For example, in the light bar of the display device, the plurality oflight sources 21 are packaged by the package 22 to obtain the integratedlight emitting body 20, so that light beams emitted by the integratedlight emitting body 20 are more denser, the light mixing distance of theintegrated light emitting body 20 is reduced, therefore the lightincident distance of the edge-type backlight module can be reduced,which is favorable for achieving the backlight module structure with asuper-short light incident distance, and the viewable region of thedisplay device is enlarged, so as to realize the narrow bezel structureof the display device.

For example, the display device may be any product or component with adisplay function, such as an OLED panel, a cell phone, a tablet, atelevision, a display, a notebook computer, a digital photo frame, anavigator and so on.

For example, the light bar, the edge-type backlight module and thedisplay device provided by the embodiments of the present disclosurehave at least one of the following technical effects:

(1) The light bar provided by at least one embodiment of the presentdisclosure can reduce the light mixing distance of the edge-typebacklight module, therefore the light incident distance of the backlightmodule is reduced and the viewable region of the display device isincreased.

(2) The edge-type backlight module provided by at least one embodimentof the present disclosure can reduce the light incident distance of thebacklight module, which is favorable for obtaining the backlight modulestructure with a super-short light incident distance, the viewableregion of the display device is increased, and therefore a narrow bezelstructure of the display device can be realized.

The following statements should be noted:

(1) The accompanying drawings involve only the structure(s) inconnection with the embodiment(s) of the present disclosure, and otherstructure(s) can be referred to common design(s).

(2) For the purpose of clarity only, in accompanying drawings forillustrating the embodiment(s) of the present disclosure, the thicknessand size of a layer or a structure may be enlarged. However, it shouldunderstood that, in the case in which a component or element such as alayer, film, area, substrate or the like is referred to be “on” or“under” another component or element, it may be directly on or under theanother component or element or a component or element is interposedtherebetween.

(3) In case of no conflict, features in one embodiment or in differentembodiments can be combined.

What are described above is related to the specific embodiments of thedisclosure only and not limitative to the scope of the disclosure. Theprotection scope of the disclosure shall be based on the protectionscope of the claims.

What is claimed is:
 1. A light bar, comprising: a circuit board and anintegrated light emitting body arranged on the circuit board, whereinthe integrated light emitting body comprises a package and a pluralityof light sources, and the package is configured to package the pluralityof light sources, wherein a light emitting surface of the integratedlight emitting body is perpendicular to a surface of the circuit boardon which the integrated light emitting body is mounted, a distancebetween the light emitting surface and an edge of the surface of thecircuit beard on which the integrated light emitting body is mounted,close to the light emitting surface and parallel to the light emittingsurface is W1, and 0.3 mm≤W1≤1.0 mm.
 2. The light bar according to claim1, wherein a material of the package is a light permeable material. 3.The light bar according to claim 1, wherein the plurality of lightsources are connected in parallel or in series.
 4. The light baraccording to claim 1, wherein the light source is an LED, and aplurality of LEDs are packaged in a direct package way.
 5. The light baraccording to claim 1, wherein along a length direction of the circuitboard, a distance between an edge of the integrated light emitting boardand a close edge of the circuit board is L1, and L1>0.5 mm.
 6. The lightbar according to claim 1, wherein the integrated light emitting body isfixedly connected with the circuit board through a pad, and a radius ofthe pad R≤0.3 mm.
 7. The light bar according to claim 1, wherein athickness of the circuit board is D1, and 0.06 mm≤D1≤0.12 mm.
 8. Thelight bar according to claim 1, wherein a thickness of the integratedlight emitting body is D2, and 0.3 mm≤D2≤0.6 mm.
 9. An edge-typebacklight module, comprising the light bar according to claim
 1. 10. Theedge-type backlight module according to claim 9, further comprising alight guide plate, wherein the light guide plate is arranged on a lightemitting surface side of the light bar, and the circuit board isarranged on the light guide plate.
 11. The edge-type backlight moduleaccording to claim 10, wherein the light bar is fixed to the light guideplate by a glue arranged on a main surface of the circuit board, theglue covers the light bar and exposes the integrated light emittingbody.
 12. The edge-type backlight module according to claim 11, whereinalong a width direction of the light bar, the glue exceeds a side edgeof the light bar.
 13. The edge-type backlight module according to claim12, wherein the width of the glue exceeding the edge of the light bar isW2, and 0.25 mm≤W2≤1.0 mm.
 14. The edge-type backlight module accordingto claim 11, further comprising an optical film arranged on a light exitside of the light guide plate, and the optical film overlaps the sideedge that exceeds the light bar of the glue.
 15. The edge-type backlightmodule according to claim 11, wherein a thickness of the glue is D3, and0.03 mm≤D3≤0.06 mm.
 16. The edge-type backlight module according toclaim 15, wherein a gap between the glue and the integrated lightemitting body is W3, and 0.1 mm≤W3≤0.15 mm.
 17. The edge-type backlightmodule according to claim 9, further comprising a light shielding tape,wherein the light shielding tape is arranged on a back surface of thecircuit board of the light bar and extends from an edge of the circuitboard onto the light guide plate.
 18. The edge-type backlight moduleaccording to claim 17, wherein a distance between a light exit surfaceof the light bar and an edge of the light shielding tape on the lightguide plate is K, and 0.8 mm≤K≤2.0 mm.
 19. A display device, comprisingthe edge-type backlight module according to claim 9.